Products
Monocrystalline Silicon for infrared optics and CO2 lasers
- Outside diameter: up to Ф155 mm
- Conductivity type: – P or N
- Orientation -100, 111
- Transmittance - >52%
- Resistance for optical quality
- N type – 10 ÷ 30 Ω/сm
- Р type – 15 ÷ 40 Ω/сm
- Resistance for mirrors
- N and Р type – 0,005 ÷ 0,2 Ω/cm
- Shape – cylindrical, rectangular
- Ingot Diameter tolerance - ±0,03 mm
- Blank Thickness tolerance - ±0,025 mm
Sputtering targets from crystalline Silicon
- We produce targets, both single pieces and complete sets
- Resistance – as per customer’s specifications
- Conductivity type: – P or N
- Shape – round or rectangular
- Maximum diameter – Ф155 ± 0,1 mm
- Maximum diagonal of rectangular targets – 160 ± 0,2 mm
- Maximum thickness – 100 mm ± 0,025 mm
Monocrystalline Silicon for photovoltaics
| Conductivity type: | Р Type (Boron) |
| Orientation | 100 ±2° |
| Carbon content | Less than 5х1016 at. cm3 |
| Oxygen content | Less than 1х1018 at.cm3 |
| Resistance | 0,5 ÷ 3 Ω/сm |
| Shape | Full square 100х100 from Ф 135 mm Pseudo-square 100х100 from Ф125 mm Pseudo-square 125х125 from Ф150 mm |
Monocrystalline Silicon for microelectronics
| Conductivity type: | Р Type (Boron) |
| Orientation | 100 and 111 ±2° |
| Carbon content | Less than 2.5х1016 at.cm3 |
| Oxygen content | Less than 1х1018 at.cm3 |
| Resistance | 0,05 ÷ 45 ± 20% Ω/сm |
| Shape | Grinded cylinder |
| Diameter | 76,2 mm, 100 mm, 125 mm, 150 mm |
Sliced wafers for microelectronics
| Diameter mm (inch) | 76.2 (3”) | 100 (4”) | 125 (5”) | 150 (6”) | |
| Wafer thickness(μm) | standard | >350 | >400 | >440 | >500 |
| minimum | 300 | 350 | 380 | 420 | |
| Through-the-thickness accuracy(μm) | standard | ±15 | ±20 | ±20 | ±20 |
| Thickness deviation TTV (μm) | maximum | 10 | 15 | 20 | 25 |
| standard | <7 | <10 | <10 | <12 | |
| ИWafer warp (μm) | maximum | 30 | 35 | 40 | 45 |
| standard | <15 | <15 | <20 | <25 |
Sawing of wafers from glass and semi-precious stones
- The company is technologically capable of slicing of thin wafers from optical glass and semi-precious stones.
- Wafer thickness - 0,05mm – 50mm
- Outside dimensions
- Diagonal - 140мм
- Diameter - 150мм
- Slice thickness (losses) - 0,04mm