Sliced wafers for microelectronics

Diameter mm (inch)   76.2 (3”) 100 (4”) 125 (5”) 150 (6”)
Wafer thickness(μm) standard >350 >400 >440 >500
minimum 300 350 380 420
Through-the-thickness accuracy(μm) standard ±15 ±20 ±20 ±20
Thickness deviation TTV (μm) maximum 10 15 20 25
standard <7 <10 <10 <12
đśWafer warp (μm) maximum 30 35 40 45
standard <15 <15 <20 <25