Sliced wafers for microelectronics
| Diameter mm (inch) | 76.2 (3”) | 100 (4”) | 125 (5”) | 150 (6”) | |
| Wafer thickness(μm) | standard | >350 | >400 | >440 | >500 |
| minimum | 300 | 350 | 380 | 420 | |
| Through-the-thickness accuracy(μm) | standard | ±15 | ±20 | ±20 | ±20 |
| Thickness deviation TTV (μm) | maximum | 10 | 15 | 20 | 25 |
| standard | <7 | <10 | <10 | <12 | |
| ИWafer warp (μm) | maximum | 30 | 35 | 40 | 45 |
| standard | <15 | <15 | <20 | <25 |